Modeling and investigation of minimum chip thickness for silicon carbide during quasi-intermittent vibration–assisted swing cutting

In micromachining, the quasi-intermittent vibration—assisted swing cutting technology alleviates residual height problem of elliptical vibration–assisted (EVC) and inherits its intermittent machining characteristics. The minimum chip thickness has a significant impact on forces, tool wear, process stability when working with difficult-to-machine materials. This study thoroughly examines parameters quality workpiece during in order to better understand time-varying characteristics (QVASC) size effect micro-cutting silicon carbide crystal. paper created prediction model suited QVASC process. effects variables such as velocity inclination were discussed well scribing tests that conducted challenging materials carbide. research findings shown process, critical undeformed decreased continuously sequentially increased (1.51 mm/min, 1.88 2.26 mm/min); under down angle (0–10°), also decreased. These results confirm too fast reduces instantaneous thickness, which is not conducive ductile removal.